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    Product laser

    Products
    Panel Level TGV Laser Micro-Drilling System
    Product Introduction
    This system integrates a high-precision motion platform and advanced control system with an optimized optical architecture. It is specifically designed to meet the dual demands of precision and throughput for through-glass via (TGV) processing on large-format glass substrates.
    Product Features

    High-precision dynamic tracking platform combined with responsive motion control modules for fast, accurate, and efficient laser modification of glass

    Custom-engineered optical path system tailored for multi-material compatibility and stable, repeatable process performance

    Multiple vision alignment modes adaptable to fiducial marks, external contours, and other positioning strategies

    Proprietary control software developed by DR Laser with bilingual (Chinese/English) interface for enhanced user experience


    Field of application
    Glass-based chip packaging, display chip encapsulation, etc.
    Technical indicators
    Specification
    Details
    Substrate Size
    Up to 650 × 650 mm (downward compatible)
    Loading Method
    Robotic arm / roller feed
    Processing Type
    Laser + high-precision motion platform
    Platform Speed
    ≤ 1400 mm/s
    Hole Shapes
    Circular, square, blind via, through via, micro-groove
    Minimum Hole Diameter
    5 μm
    Platform Accuracy
    Repeatability ≤ 1.5 μm; Positioning Accuracy ≤ ±3 μm
    Pattern Placement Accuracy
    ≤ ±5 μm @ 600 mm; ≤ ±3 μm @ 300 mm
    Throughput
    ≥ 5000 points per second